customer service hotline
0755-27918093-8012
This machine can suit for conductive glue, tin paste, conductive glue tape, contact IC technology. Conductive glue technology: Machine can achieve the function of milling, dust cleaning, glue dispensing, pre-welding, module punching, chip embedding, OCR checking, bad card separate collecting. Tin paste technology: Machine can achieve the function of milling, dust cleaning, tin paste dispensing, glue tape laminating, pre-welding, module punching, chip embedding, OCR checking, bad card separate collecting. different technologies can be selection.
Technical Parameter:
Overall Dimension: | L4100mm*W900mm*H1850mm |
Weight: | 2500KG |
Power Supply: | 3 phase AC380V 50/60HZ |
Power: | 12KW |
Air Supply: | 6KG/cm2 |
Air Consumption: | 800L/min |
Control System: | PC |
Applicable Materials: | Hot melt glue tape, Laminated strip module with ISO standard,0.68-0.8mm thickness ISO lamination PVC,ABS card. |
UPH: | For DI card with tin paste technology is 2500-2800 cards/h; For DI card with conductive glue technology is 3200cards/h; For normal card is 4000 cards/h; |
Yield: | 99.80% |
Module Punching Accuracy: | ±0.05mm |
Milling Position Accuracy: | ±0.05mm |
Milling Depth: | ±0.015 ~ ±0.02mm |
Milling Size: | ±0.05mm |
Embedding Position Accuracy: | ±0.05mm |
Embedding Flatness Accuracy: | ±0.05mm |
Tel:+86-755-27918093/23060983
Fax:+86-755-27918086
Add:Building B, Hongxing Xifang Industrial Park,Datianyang,
Songyu Road, Songgang Street,Bao'An District,
Shenzhen, 518105, China
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